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High Density & High Speed HSB³ Daughter Board Connector,HW-HSB-D4-05DM-022X

    Buy cheap High Density & High Speed HSB³ Daughter Board Connector,HW-HSB-D4-05DM-022X from wholesalers
     
    Buy cheap High Density & High Speed HSB³ Daughter Board Connector,HW-HSB-D4-05DM-022X from wholesalers
    • Buy cheap High Density & High Speed HSB³ Daughter Board Connector,HW-HSB-D4-05DM-022X from wholesalers
    • Buy cheap High Density & High Speed HSB³ Daughter Board Connector,HW-HSB-D4-05DM-022X from wholesalers
    • Buy cheap High Density & High Speed HSB³ Daughter Board Connector,HW-HSB-D4-05DM-022X from wholesalers
    • Buy cheap High Density & High Speed HSB³ Daughter Board Connector,HW-HSB-D4-05DM-022X from wholesalers

    High Density & High Speed HSB³ Daughter Board Connector,HW-HSB-D4-05DM-022X

    Ask Lasest Price
    Brand Name : HIGH WOOD
    Model Number : HW-HSB-D4-05DM-022X
    Certification : AS9001
    Price : 10$-150$
    Payment Terms : T/T, L/C, Western Union
    Supply Ability : 100,000pcs per month
    Delivery Time : 2-9weeks
    • Product Details
    • Company Profile

    High Density & High Speed HSB³ Daughter Board Connector,HW-HSB-D4-05DM-022X

    HW-HSB-D4-05DM-022X

    High speed configuration available that allows data rates up to 6.250 Gb/s via 100 ohm matched impedance differential pairs.

    • Partially populated standard HDB3 mother board and daugher board bodie

    Mates with:
    • High Speed Mother Board

    HSB³ HIGH DENSITY CONNECTOR FEATURES:

    • Polarization: “D” shaped design
    • Keying: Optional keys offer 36 unique keying combinations
    • Guide:Pins Optional guide pins provide additional alignment
    • Radial Misalignment:Capable of correcting up to a 020” initial radial misalignment
    • Angular Misalignment:Capable of mating with up to a 2° initial angular misalignment

    How to order:

    1234567

    Number of

    Differential Pairs

    Differential SignalBrush Wire PlatingTermination

    Contact

    Termination

    Finish

    Less Hardware (Purchased separately see pg XX for hardware options)
    HSB-D4-03DM022X

    1. Connector Type

    HSB-D4

    Designates High Speed HSB³ Daughter Board


    2. Number of Contacts

    Number

    Differential

    Pairs

    No. Low

    Speed

    Signals

    Dimension ADimension C
    03201.3751.075
    05301.7251.425
    07402.0751.775
    10602.7752.475
    13803.4753.175

    3. Differential Signal

    DStandard

    4. Brush Wire Plating

    M0.000050 Au Min. thick over Nickel
    C0.000020 Au Min. thick over Nickel

    5. Termination

    TypeStickout (Dim. E)
    01PCB, Straight, .016 Dia0.090
    02PCB, Straight, .016 Dia0.120
    03PCB, Straight, .016 Dia0.150
    04PCB, Straight, .016 Dia0.180
    06PCB, Straight, .016 Dia0.300

    6. Contact Termination Finish

    2

    Gold plated in accordance with MIL-G-45204, Type II, .000030 Min. thick Gold over .000050 Min.thick Nickel

    5

    Tin plated in accordance with ASTM B545, .00010 Min. thick Matte Tin over .00010 Min. thick Nickel

    6

    Tin-Lead plated in accordance with SAE-AMS-P-81728, .00010 Min. thick Tin-Lead over .00010 Min. thick Copper

    7. Hardware
    XLess Hardware

    Product pictures:

    High Density & High Speed HSB³ Daughter Board Connector,HW-HSB-D4-05DM-022XHigh Density & High Speed HSB³ Daughter Board Connector,HW-HSB-D4-05DM-022XHigh Density & High Speed HSB³ Daughter Board Connector,HW-HSB-D4-05DM-022XHigh Density & High Speed HSB³ Daughter Board Connector,HW-HSB-D4-05DM-022X


    HDB³ & HSB³ HIGH DENSITY CONNECTOR PERFORMANCE:

    Durability:100,000 mating cycles
    Insertion/Extraction Force:1.5 ounce typical per contact
    Operating Temperature:-65° to 125°C
    Current Rating:

    2 amperes Hot swap 1 ampere maximum (load dependent)

    Insulation Resistance:5 gigaohms minimum

    Dielectric Withstanding Voltage:

    750 volts, 60 hertz, rms @ Sea Level, 250 volts, 60 hertz, rms @ 70,000 feet elevation
    Solderability:MIL-STD-202, Method 208
    Salt Fog:48 Hours IAW MIL-STD-1344, method 1001, test condition B
    Humidity:IAW MIL-STD-1344, method 1002, type II
    Vibration:4 hours in each of 3 mutually perpendicular axes IAW MIL STD-1344, method 2005, test condition V, letter H
    Shock:1 shock along each of three mutually perpendicular axes IAW MIL-STD-1344, method 2004,test condition G
    Data Rate (HSB3 ):

    Capable of up to 6.250 Gbps (consult Amphenol for arrangement)


    MATERIALS:

    Insulator:Liquid crystal polymer, 30% glass filled
    Contact:WireBeryllium copper per ASTM B197; finish is gold per ASTM B488 over nickel per AMS-QQ-N-290
    Holder:Brass similar to UNS C33500; available finishes include gold per MIL-G-45204, tin-lead per MIL-P- 81728 or tin per MIL-T-10727 (RoHS Compliant)
    Sleeve:Stainless steel per AMS-5514, passivated IAW QQ-P-35 (Daughter board, I/O and Stacker connector)

    Quality High Density & High Speed HSB³ Daughter Board Connector,HW-HSB-D4-05DM-022X for sale
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